Rapid Prototyping and On-Demand Production for
Semiconductor
Industry
Accelerate your semiconductor manufacturing process with outstanding prototyping and innovative product development
Technology Production
& DFM
STEP files accepted
Capabilities Available
Why Semiconductor Companies Choose Dakings Rapid
High-Precision Manufacturing
When high-precision manufacturing is required, dakingsrapid delivers CNC-machined components with industry-leading tolerances.
Get to Market Faster
With quotes available within 4 hours and high-precision parts delivered in just a few days, engineers can shorten production cycles by up to 50%.
Industry Leading Quality
With materials certifications, verified dimensional inspections, and COCs available with every order.
Solving Semiconductor Manufacturing Challenges
Mastering sub-micron geometric tolerances (flatness ≤0.005mm/m) via multi-step stress relief and ultra-precision grinding.
Sourcing and processing Invar, PEEK, and 316L stainless steel with strict batch traceability and cleanroom-ready material certification.
Cleanroom-Compliant Production
ISO 8 cleanroom processing (particles ≤5μm) and low-outgassing surface treatments for contamination-sensitive applications.
Simplified Sourcing for the Semiconductor Industry
Popular Assemblies & Parts Made by Dakings Rapid
Quantum Computing
- Prototypes and precision components
- Tight tolerances
- High-performance semiconductor parts
Integrated Device Manufacturing
- Satellites
- Monitoring equipment
Fabless Semiconductor
- Smart phones
- Networking equipment
- Graphics cards
Memory Manufacturers
- Storage devices
- Smart phones
- Computers
Foundries
- Consumer electronics
- Automotive
Equipment Manufacturers
- Semiconductor manufacturing processes, including lithography, etching, and deposition
Materials & Surface Treatments
High-Performance Materials & Cleanroom-Grade Finishes
Key Materials
Metals: Aluminum (6061/7075), 304/316L stainless steel, titanium (TC4), Invar alloy.
Plastics: PEEK, PTFE, FEP, epoxy fiberglass.
Surface Treatments
Metals: Anodizing (aluminum parts); powder coating (steel components); electroplating (titanium); polishing (stainless steel).
Plastics: Polishing (PEEK); plating (PTFE); spray painting (epoxy fiberglass).
Technical Capabilities
Advanced Manufacturing for Semiconductor Parts
5-Axis CNC Machining
Handles complex semiconductor structures (e.g., vacuum chamber flow channels) with ±1μm dimensional accuracy for equipment frames and manifolds.
EDM & Ultra-Precision Grinding
Creates mirror-finish surfaces (Ra≤0.02μm) via wire EDM and ultra-fine grinding—critical for wafer stages and sealing faces.
Specialized Material Expertise
Sources & processes metals (Aluminum 6061/7075, 316L SS, titanium, Invar) and plastics (PEEK, PTFE/PFA) with cleanroom-grade traceability.
Cleanroom Compliance
ISO 8 cleanroom-certified production with Class 100 cleaning (particles ≤5μm) and 10+ year traceable documentation.
Parts: ESC bases, gas shower pipe brackets, linea!uide supportsspecs: Titanium316L, +0.005mm tolerance
Parts: Wafer stages, vacuum chamber flanges, valvepindles Specs: Invar/PEEK, flatness s0.003mm/m.
Parts: Probe socket grooves, test fixtures, fluidicconnectors.Specs:316L/PTFE,corrosion-resistant, low particle
Semiconductor Manufacturing: From Concept to Full Lifecycle
FAQs
A: Semiconductor manufacturing demands sub-micron tolerances, ISO 8 cleanroom standards (low particle counts), and complex material processing (e.g., stress control for titanium/Invar alloys)—all while delivering fast turnaround for low-volume, high-variety parts.