- 5-Axis CNC MachiningHandles complex semiconductor structures (e.g., vacuum chamber flow channels) with ±1μm dimensional accuracy for equipment frames and manifolds.
- EDM & Ultra-Precision GrindingCreates mirror-finish surfaces (Ra≤0.02μm) via wire EDM and ultra-fine grinding—critical for wafer stages and sealing faces.
- Specialized Material ExpertiseSources & processes metals (Aluminum 6061/7075, 316L SS, titanium, Invar) and plastics (PEEK, PTFE/PFA) with cleanroom-grade traceability.
- Cleanroom ComplianceISO 8 cleanroom-certified production with Class 100 cleaning (particles ≤5μm) and 10+ year traceable documentation.